n 專長及擔任課程
1.粉末冶金、壓鑄模設計、熱處理、機械材料
2.薄膜工程、表面處理(熱處理)、微模具(電鑄模具)
n 最 高 學 歷
國立中山大學 材料所博士
n 經 歷
高雄工專模具工程系主任
n 現 任
國立高雄應用科技大學模具工程系副教授
期刊論文
1. S. Y. Chiou and D. Gan “Interfacial Mechanical Properties of TiN Coated on Steels by Indentation”, J. of Materials Science, accepted.
2. S.Y. Chiou 『Mechanical Properties of Nitride and DLC Coated on Electrodeposited Ni and Ni-Co Alloy』, Thin Solid Films, submitted.
3. I.M. Chen, S.W. Yeh, S.Y. Chiou, D. Gan and P. Shen(in pressing) “Condensation of Tetragonal Zirconia Polycrystals by Reactive Sputtering.”Thin Solid Films, vol.491, 339-346,2005.
4. K. L. Ou, S. Y. Chiou, M. H. Lin, and R. Q. Hsu,『Barrier Capability of Hf-N Films with Various Nitrogen Concentrations Against Copper Diffusion in Cu/Hf-N/n+-p Junction Diodes,』J. Electrochem. Soc.,152(2)(2005)
5. K. L. Ou. S. Y. Chiou and M. H. Lin, 『High Cu Diffusion Resistance in Ultrathin Multi-quasi-amorphous CVD-Ti/TiNx Films,』J. Electrochem Soc., 151[11],G766-771,2004.
6. K. L. Ou. M. H. Lin and S. Y. Chiou,『Nanostructured Tan(O)/TaN Barrier Film Formed by Plasma Treatment for Cu Interconnect,』Electrochemical and Solid-State Letters, 7[11],G272-275,2004.
7. M. H. Lin and S. Y. Chiou,『Effect of Phase Formation Behavior on Thermal Stability of Hafuium Based Thin Film for Copper Interconnects.』Jpn J. Appl. Phys.,43[6A],3340-45,2004.
8. K.L Ou, W.F. Wu, C.P. Chou, S.Y. Chiou, and C.C. Wu, 『Imporved TaN Barrier Layer Against Cu Diffusion by Formation of an Amorphous Layer Using Plasma Treatment.』,Journal of Vacuum and Science Technology B 20(5),2154,2002.
9. 邱錫榮, 『鈦基氮化物薄膜濺鍍於鋼上介面機械性質,氧化性組與為組織』,博士論文(中山大學材料科學研究所),2001.
10. S.Y.Chiou, Bing H Hwang,『Residual Stress and Strains of Highly Textured ZrN Films Examined by X-ray Diffraction Methods,』Phys D:Appl.Phys,31,349-354,1998.
11. Bing , H. Hwang and S.Y. Chiou,『An XRD Study Of Highly Texture Thin Films,』Thin Solid Films,P 286-P292.,July , 1997.
12. 歐耿良, 葉醫民, 邱錫榮, 徐瑞坤,『奈米微模具製程及應用介紹』中華民國模具發展協會
13. Shiyung Chiou ,Wen Fong Wang,『Precipitation Strengthening of Sintered Fe-Ni-Al Alloys,』Powder Metall, INT.,Vol.8, No.6.,P411,1986.
14. 邱錫榮,『Fe-Ni-Al 燒結合金析出硬化之研究,』高雄工專學報,P3- 11,36.,1983.
15. 邱錫榮,洪志高,『鐵,錳含量對矽青銅機械性能影響,』鑄工,pp.3-11,36.,1983.
16. 邱錫榮,『從破壞觀點看鑄件之冶金設計,』鑄工,pp.27.,1980.
17. 邱錫榮,『灰口鑄鐵之疲勞及破裂機構,』鑄工,pp.28-35,23.,1979.
18. 邱錫榮,『馬達軸頸斷裂研判,』工業技術,pp.40-45,S2-10.,1979.
19. 邱錫榮,傳兆章,『捲揚機傳動軸固定螺絲桿破斷分析,』工程,pp.29-32.,1979.
20. 邱錫榮,李汝桐,洪銘盤,『預力及熱處理對61S鋁合金疲勞性能之影響,』礦冶, (碩士論文),pp.15-22.,1974.
研討會論文
專書及專書研討會論文
1.邱錫榮,謝世峰,1994. “離子氮化對JIS SKD61 模具鋼機械性能之影響.” 教育新研究計畫.
2. S. L. Chen, M. H. Lin, S.
Y. Chiou and S. L. Lin,"Powder fabrication of tungsten carbide by
electrical discharge machining," 18th. Nat. Conf. On Mech. Eng.,
pp.719-25 (2001).
3. M. H. Lin, S. L. Chen, S. Y. Chiou and C. H. Chen,"Properties and microstructures of electro-discharge machined surface of Fe-Al-Mn alloy." 19th. Nat. Conf. On Mech. Eng., D6-024 (2002).
4.
陳順隆,林明宏,邱錫榮 ,”鋯鈦酸鉛靶材之製備,”
Proceedings of the 3rd KUAS academic symposium, pp. 248-252 (2002).
5.
M. H Lin and S. Y. Chiou,”Processing and
Properties of Multilayered PZT Piezoelectric Thin Films for
Microelectromechanical Systems,” Proceedings of the 3rd KUAS academic symposium, pp. 227-230 (2002).
6.
陳順隆,林明宏,謝煜生,邱錫榮,”多電極切桿機構之特性研究”,20th.
Nat. Conf. On Mech. Eng., D06-28 (2003)
7.
林明宏,邱錫榮,陳順隆,”以放電加工法合成奈米碳化鎢粉體”,
Proc.
Chinese Mater. Sci. Soc., PH-063 (2003). (NSC
91-2212-E-151-005)
8. K.L. Ou, Y.M. Yeh, S. Y. Chiou and S.Y. Lee, ”Properties of Nanocrystalline Ni-Fe Alloy Using
Microelectroforming in Molding Insert, 24nd Interational
Conference, Orlando, Florida, USA, (Oct 2003).”
9. 葉醫民, 邱錫榮,
.歐耿良, 李勝楊,
Laser-LIGA 製作3D陣列微模具之研究.2003
模具之會.
10.
Ming-Hong Linand, S.
Y. Chiou,
“Processing
and Properties of Multilayered DZT Piezoelectric Thim Film for
Microelectromechanical Systems”.
11.
K.L. Ou, Y.M. Yeh, S.
Y. Chiou,
Y.N. Lim, “Research of Fabrication and Properties on Ni-Fe Nanocomposite with
Nano-TiO2 by UV-LIGA”,
The International Conference on Electrical Engineering (ICEE 2004), submitted.
12.
K.L. Ou, S.
Y. Chiou,
S.Y. Lee, J.L. Hus and C.W. Yen, “Comparative
study of PECVD Ti, Ti/TiNx and PVD Ti as a diffusion barrier for
high-aspect trench by e-beam lithography”, The International Conference on Electrical Engineering (ICEE 2004),
submitted.
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